Method of manufacturing semi-conductor devices
US4079509A · kind A · utility
20Cited by
1References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 1975 |
| Grant date | Mar 21, 1978 |
| Priority date | — |
| Expiry date | Jun 16, 1995 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53261
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor devices are mounted on corresponding lead frames by being inserted into apertures of a masking member in a desired registration with the lead frame strip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.