Molded circuit board substrate
US4080513A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 3, 1975 |
| Grant date | Mar 21, 1978 |
| Priority date | — |
| Expiry date | Nov 3, 1995 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0565
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention is directed to a method of preparing a substrate to improve the adherence of a metallic coating to the substrate and the product thereof. More particularly, a method of manufactiring a molded circuit board and unique circuit board produced thereby, is disclosed. A molding compound, such as an epoxy resin is blended with a plating additive, such as calcium carbonate that is relatively inert to the molding compound. The blended mix can then be molded into a desired shape which, for a printed circuit board, can be a relatively flat plate configuration with a recessed groove and hole formation pattern. The high relief areas of the circuit board can be masked with a protective material. The plating additive can then be chemically etched from the grooved recessed area and holes, for example, by a hydrochloric acid bath. Appropriate catalyst and accelerators can be applied to the recessed groove pattern before the protective mask material is removed. In one embodiment, an electroless plating nickel material can be deposited to permit it to penetrate the interstices or cavity pattern, left in the recessed groove and hole pattern by the etching of the plating additive.…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.