Patent · US Expired

Hot melt adhesive composition for hot melt bonding of fibrous or surface-porous materials

US4081414A · kind A · utility

8Cited by
4References
17Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 11, 1975
Grant dateMar 28, 1978
Priority date
Expiry dateDec 11, 1995

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S525/914
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

A hot melt adhesive composition consisting essentially of 100 parts by weight of polybutadiene having a 1,2-bond structure content of not less than 70% and a crystallinity of not less than 10%, from 50 to 1000 parts by weight of at least one inorganic filler, from 10 to 300 parts by weight of at least one tackifier, and at least one plasticizer and/or at least one flow improving agent, said composition having melt viscosity of from 50 to 50000 poises within a temperature range from 100.degree. to 150.degree. C.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.