Pneumatic system for solder leveling apparatus
US4083323A · kind A · utility
22Cited by
6References
1Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 7, 1975 |
| Grant date | Apr 11, 1978 |
| Priority date | — |
| Expiry date | Aug 7, 1995 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1518
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solder levelling machine which uses a hot gas emanating from opposed gas knives to remove excess molten solder from a printed circuit board as the board is withdrawn from a bath of molten solder contained in a self-purging solder pot. The hot gas clears the through-holes in the circuit board and allows a controllable desired thickness of solder to remain on the board and in the through holes. A pair of heaters supplies the hot gas to the knives through a manifolding arrangement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.