Lead-free glaze for alumina bodies
US4084976A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 20, 1977 |
| Grant date | Apr 18, 1978 |
| Priority date | — |
| Expiry date | Jul 20, 1997 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C3/093
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A high-silica ceramic glaze, having a low coefficient of thermal expansion, suitable for application to alumina bodies, is disclosed. The glaze comprises, by weight percent, about 50 percent SiO.sub.2, from 5 to 8 percent Al.sub.2 O.sub.3, from 6 to 12 percent B.sub.2 O.sub.3, from 2 to 15 percent BaO, from 5 to 8 percent SrO, from 4 to 6 percent CaO, from 2 to 8 percent MgO, from 1 to 2 percent ZnO, and about 5 percent total of Na.sub.2 O, K.sub.2 O, Li.sub.2 O, and minor impurities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.