Method of electroplating interconnections
US4088546A · kind A · utility
14Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 1, 1977 |
| Grant date | May 9, 1978 |
| Priority date | — |
| Expiry date | Mar 1, 1997 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76879
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming interconnections is described wherein small gaps between contacts are bridged by electroplating metal onto both contacts to form a conductive path therebetween. Many interconnections may be made simultaneously between adjacent contacts by bridging the gap with metal by electroplating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.