Cathode sputtering apparatus
US4090941A · kind A · utility
12Cited by
2References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 18, 1977 |
| Grant date | May 23, 1978 |
| Priority date | — |
| Expiry date | Mar 18, 1997 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T50/60
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods and apparatus for depositing a coating material on an underlying substrate are disclosed. Cathode sputtering techniques for rapidly depositing a relatively thick coating on a substrate having a complex geometry are developed. The apparatus employed includes a sputtering chamber formed between a center, post cathode and a hollow, cylindrical cathode. In one embodiment a magnetic field is imposed upon the sputtering chamber to concentrate the sputtered coating material in a preferred region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.