Hot melt sealant composition
US4092282A · kind A · utility
22Cited by
3References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 19, 1977 |
| Grant date | May 30, 1978 |
| Priority date | — |
| Expiry date | Aug 19, 1997 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/54
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Hot melt sealant compositions having superior adhesive bonding properties comprise butyl rubber, plasticizing or tackifying resins, and a reacted mixture of an alkaline earth metal hydroxide and a solid polyamide resin having a high amine value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.