Process of cutting wafers
US4092972A · kind A · utility
11Cited by
4References
23Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 11, 1977 |
| Grant date | Jun 6, 1978 |
| Priority date | — |
| Expiry date | Feb 11, 1997 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28D5/042
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In a cutting process in which a blade under tension is moved relative to a workpiece, that improvement wherein the blade has a longitudinally-extending abrasive-holding portion defined by blade material that is softer than the workpiece to be cut and overlies a high tensile strength core, the blade is placed under tension adjacent a charging element, and abrasive particles are introduced into the interface between the blade and charging element and partially embedded in the abrasive-holding portion by moving the blade relative to the charging element while forcing the blade and element towards each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.