Heat-resistant thermosetting polyimide resin with bis-phenol-epichlorohydrin reaction product
US4097545A · kind A · utility
2Cited by
1References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 1976 |
| Grant date | Jun 27, 1978 |
| Priority date | — |
| Expiry date | Aug 30, 1996 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G73/125
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A heat-resistant thermosetting resin composition is obtained by reaction with each other of an N,N'-bis-imide of unsaturated dicarboxylic acid (A), a cyanuric or isocyanuric acid or derivatives thereof (B), and at least one compound (C) selected from the group consisting of tetracarboxylic acid diimide, hydantoin and derivatives thereof, and barbituric acid and derivatives thereof. This resin composition has excellent heat-resistance and workability, and is employed for the use of a molding, laminated sheet, adhesive, etc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.