Bonding method and apparatus
US4098447A · kind A · utility
25Cited by
3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 14, 1976 |
| Grant date | Jul 4, 1978 |
| Priority date | — |
| Expiry date | May 14, 1996 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Difficulties in forming a ball on the end of a wire of aluminium or aluminium alloy for ball bonding are overcome by applying between the wire and an electrode a low voltage, typically 30 volts, and bringing the wire and electrode into temporary contact to fuse the wire and initiate a spark discharge which results in the formation of a ball on the wire end. The spark discharge takes place in a shielding gas to avoid oxidation of the ball.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.