Severing wire or ribbon material adjacent an attachment point, such as a solder, bond or weld connection, particularly in semiconductor and thin film structures
US4099663A · kind A · utility
6Cited by
2References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 11, 1977 |
| Grant date | Jul 11, 1978 |
| Priority date | — |
| Expiry date | Mar 11, 1997 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49194
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The wire, ribbon, or the like, is repetitively bent back and forth until it breaks, the bending being, preferably, effected rapidly, for example by means of an electromagnet fed, for example, with line frequency alternating current. The wire is guided in a guide tool which deflects the wire transversely to its axis rapidly back and forth, thus effecting breaking within about one second of application of bending stresses. This is particularly useful to sever tiny wires, in the order of 100 .mu.m diameter, as connecting leads in semiconductor and thin film technology.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.