Electroless copper solution
US4099974A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 1976 |
| Grant date | Jul 11, 1978 |
| Priority date | — |
| Expiry date | Mar 10, 1996 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/405
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroless copper solution capable of forming an electroless deposited copper film having as a higher elongation as that of electro deposited copper film is provided, which is characterized by adding either 2,2'-dipyridyl or 2,9-dimethyl-1,10-phenanthroline, and polyethylene glycol to the well known electroless copper solution containing a copper salt, such as cupric sulfate, a complexing agent such as ethylenediaminetetraacetic acid, a reducing agent such as formalin, and a pH-adjusting agent such as alkali hydroxide as main components. The present copper solution can provide not only a higher elongation of deposited film, but also higher depositing rate, about 3 - 4 .mu.m/hr, which is equal or superior to that of the conventional art.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.