Method of depositing a metal on a surface
US4100037A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 8, 1976 |
| Grant date | Jul 11, 1978 |
| Priority date | — |
| Expiry date | Mar 8, 1996 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1415
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of depositing a metal on a surface of a substrate is disclosed. The method comprises selectively coating portions of the surface with a colloidophobic material to render the portions colloidophobic and to delineate an exposed surface pattern which is capable of retaining a colloidal species thereon. The selectively coated surface is treated with a sol comprising a colloidal species selected from the group comprising (1) a species capable of reducing an activating metal ion to an activating metal, and (2) a colloidal activating metal species capable of participating in an electroless metal deposition to deposit the colloidal species on the exposed surface pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.