Process for curing of adhesives for flocking and texturing on heat-sensitive substrates, by electron-beam radiation
US4100311A · kind A · utility
14Cited by
4References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 21, 1976 |
| Grant date | Jul 11, 1978 |
| Priority date | — |
| Expiry date | Jun 21, 1996 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/23986
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The disclosure herein is concerned with critical electron-beam radiation parameters and beam-passage rates and adjustments that have been found to enable high-speed curing of adhesives used to bond flock and similar materials to heat-sensitive substrates that otherwise inherently limit the degree of thermal curing that may be employed as by other means, and consequently limit the speed of curing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.