Metal leaf
US4100317A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 1975 |
| Grant date | Jul 11, 1978 |
| Priority date | — |
| Expiry date | May 19, 1995 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31692
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A metal leaf comprising (1) a resinous layer having a thickness of 0.35 to 1.mu., (2) a deposition layer, made of a metal selected from the group consisting of gold, silver, aluminum and copper, having a thickness of 0.03 to 0.1.mu., and (3) a resinous layer having a thickness of 0.35 to 1.mu.; which being integrated in order of (1), (2) and (3) and having a thickness of 0.73 to 2.1.mu. and a tensile strength of 0.01 to 1.4 kg./mm.sup.2. It has the same characteristics as those of a conventional metal leaf by handicrafting, and is produced by providing the metal leaf on a base film, elongating the base film to peel out of the leaf and recovering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.