Magnetic bubble module
US4101970A · kind A · utility
10Cited by
1References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 8, 1976 |
| Grant date | Jul 18, 1978 |
| Priority date | — |
| Expiry date | Jul 8, 1996 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C19/085
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In a magnetic bubble module comprising magnetic bubble chips disposed on substrates and driving coils surrounding the magnetic bubble chips, at least one of the substrates extends from the inside to the outside of the coils and serves as a heat transfer plate. The heat transfer plate includes at least one metal foil having a thickness smaller than a skin depth of the metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.