Nickel-iron (80:20) alloy thin film electroplating method and electrochemical treatment and plating apparatus
US4102756A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 1976 |
| Grant date | Jul 25, 1978 |
| Priority date | — |
| Expiry date | Dec 30, 1996 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F41/26
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A thin film of low magnetostriction Permalloy 80% nickel - 20% iron .+-. 1% is electroplated in a bath having a ratio of about 1.8:1 to 24:1 g/liter ratio of Ni to Fe ions with a plating current density from 10 ma/cm.sup.2 - 200 ma/cm.sup.2 when plating in sheet form or an Ni/Fe ratio of 25:1 to 85:1 with a current density of 2 ma/cm.sup.2 - 110 ma/cm.sup.2 when plating through a mask. The fluid in the system is constantly mixed, replenished with fresh iron, acid, and other reagents, is adjusted in temperature and subjected to a continuous laminar regime of mixing. Fresh solution is added to the bath from a reservoir where the above adjustments are made. The inlet for the fresh solution is at the lower end of the plating chamber and directed at a bath mixer which includes a slot through which the fresh solution is directed to optimize mixing in the plating chamber. Complexing agents are avoided. High speed plating is obtained with about 24.4 g/l of Ni.sup.++, 1.05 g/l of Fe.sup.++, 25 g/l of H.sub.3 BO.sub.3, 0.2 g/l of Na saccharin and a pH of 1.5 to 3.6.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.