Wafer mounting structure for pickup tube
US4103203A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 9, 1974 |
| Grant date | Jul 25, 1978 |
| Priority date | — |
| Expiry date | Sep 9, 1994 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J29/02
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A thin target wafer of silicon includes a light receiving surface which is mounted to an inner faceplate surface of a pickup tube envelope by an interposed region of transparent adhesive. The peripheral edge of the adhesive is sealed by a conductive sealant material to substantially prevent outgassing of the adhesive within the interior of the envelope. In one embodiment, a conductive sealant material is provided by which electrical contact from the wafer to an electrical connector, extending external to the envelope, is established. A method of assembly of the wafer with the faceplate is provided wherein residual bubbles of the interposed flowable adhesive are substantially collapsed by assembly of the wafer and the faceplate in a vacuum, and, thereafter, exposing the wafer-faceplate assembly to atmospheric pressure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.