Composite electric circuit structure of a printed circuit and heat generating discrete electrical component
US4103321A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 1976 |
| Grant date | Jul 25, 1978 |
| Priority date | — |
| Expiry date | Dec 17, 1996 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10553
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
To prevent failure of solder connections between projecting pins from discrete electrical components, such as power transistors, and printed circuit paths formed on an insulated substrate, the space between the semiconductor and an attached cooling plate in the region of the pin is increased to permit lateral excursion of the pin, without electrical contact with the cooling plate, and thus prevent failure of the solder connection. The space can be increased by, for example, the relieving the thickness of the cooling plate in the region where the pin passes therethrough, or spacers can be inserted between the cooling plate and the insulating board on which the printed circuit is carried, both solutions providing for some flexibility of the mounting and hence deflection of the connecting pin from the semiconductor to the solder connection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.