Process for manufacturing printed circuit boards
US4104111A · kind A · utility
49Cited by
3References
10Claims
0Family size
Inventor
Key dates
| Filing date | Aug 3, 1977 |
| Grant date | Aug 1, 1978 |
| Priority date | — |
| Expiry date | Aug 3, 1997 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0574
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Printed circuits are fabricated by a process which employs initial chemical deposition of copper on a predrilled substrate followed by electroplating build-up of conductors to desired pattern. The conductors are then passivated by thinly plating them with a mechanically durable, chemically passive metal. To provide solder compatibility in areas where connections are to be made to the printed circuits, a plating of tin/lead is applied in those areas while making all other areas to eliminate plating. The remaining exposed copper is then etched away. An insulating solder mask is then applied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.