Adhesive composition containing a pre-blended polyphenylene ether resin
US4104323A · kind A · utility
26Cited by
14References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 18, 1977 |
| Grant date | Aug 1, 1978 |
| Priority date | — |
| Expiry date | Apr 18, 1997 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An adhesive composition and process for making the same are disclosed wherein the adhesive composition has greatly improved high temperature properties. The adhesive composition is prepared by first melt blending a polyphenylene ether resin and a low molecular weight resin, and then blending the resulting mixture with a monoalkenyl arene/conjugated diene block copolymer, tackifying resin, and optional hydrocarbon processing oil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.