Method of making a glass containing resistor having a sub-micron metal film termination
US4104421A · kind A · utility
13Cited by
4References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 3, 1976 |
| Grant date | Aug 1, 1978 |
| Priority date | — |
| Expiry date | Aug 3, 1996 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C17/283
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A cermet resistor employs film terminations of sub-micron thickness. The terminations contain particles of SiO.sub.2 or MnO.sub.2 that may be conveniently made by mixing such particles in a metal resinate paste, screening the paste on a glazed or unglazed substrate and firing. A glass containing resistor paste is screened in overlapping relationship with the fired terminations and is itself fired. The particle additives ameliorate cracking of the terminations at resistor firing and enhance the termination to substrate bond.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.