Method of embedding an end of a bundle of thread-like bodies in a molding material and controlling capillary action by said material
US4105731A · kind A · utility
74Cited by
6References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 1, 1977 |
| Grant date | Aug 8, 1978 |
| Priority date | — |
| Expiry date | Jul 1, 1997 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S264/75
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
An end portion of a bundle of thread-like bodies to be set is dipped into a solidifiable liquid. At least a part of said bundle, adjacent to the predetermined level of the solidifiable liquid, is contacted with a specific liquid or gas which substantially prevents wicking of said solidifiable liquid along said thread-like bodies due to capillary action. The solidifiable liquid is not drawn up through the bundle beyond predetermined level of the solidifiable liquid, and solidified at the predetermined level.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.