Heat-resistant thermosetting polyimide resin
US4107153A · kind A · utility
26Cited by
1References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 1975 |
| Grant date | Aug 15, 1978 |
| Priority date | — |
| Expiry date | Sep 23, 1995 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A heat-resistant thermosetting resin composition is obtained by reaction with each other of an N,N'-bis-imide of unsaturated dicarboxylic acid (A), a cyanuric or isocyanuric acid or derivatives thereof (B), and at least one compound (C) selected from the group consisting of tetracarboxylic acid diimide, hydantoin and derivatives thereof, and barbituric acid and derivatives thereof. This resin composition has excellent heat-resistance and workability, and is employed for the use of a molding, laminated sheet, adhesive, etc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.