Resin sealed semiconductor device
US4107727A · kind A · utility
15Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 26, 1977 |
| Grant date | Aug 15, 1978 |
| Priority date | — |
| Expiry date | Jul 26, 1997 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is disclosed wherein a semiconductor pellet is attached on a heat sink of a flange, leads are connected to corresponding electrodes of the semiconductor pellet directly or through wires, the semiconductor pellet and portions of the leads are sealed by resin mold on the flange and top outer periphery of the heat sink is formed with a projection to prevent peel-off of the resin mold and cracking of the resin mold which would otherwise occur due to difference between coefficients of thermal expansion of the flange and the resin mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.