Zirconium layer for bonding diamond compact to cemented carbide backing
US4108614A · kind A · utility
113Cited by
13References
5Claims
0Family size
Inventor
Key dates
| Filing date | Mar 31, 1977 |
| Grant date | Aug 22, 1978 |
| Priority date | — |
| Expiry date | Mar 31, 1997 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/08
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An abrasive body comprising a diamond compact bonded to a cemented carbide backing by means of a continuous zirconium layer, the thickness of which is less than 0.5 mm, the diamond compact being substantially free of graphite and having a bonding matrix selected from a metal of Group VIII of the Periodic Table or an alloy containing one or more such metals and at least 70 percent by volume of diamond particles, and the cemented carbide backing being selected from cemented tantalum carbide, cemented tungsten carbide and cemented titanium carbide and mixtures thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.