Electroless plating apparatus for discrete microsized particles
US4109612A · kind A · utility
3Cited by
5References
1Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 16, 1975 |
| Grant date | Aug 29, 1978 |
| Priority date | — |
| Expiry date | Sep 16, 1995 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/1683
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Method and apparatus are disclosed for producing very uniform coatings of a desired material on discrete microsized particles by electroless techniques. Agglomeration or bridging of the particles during the deposition process is prevented by imparting a sufficiently random motion to the particles that they are not in contact with each other for a time sufficient for such to occur.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.