Automatic height sensor for semiconductor bonding tool, wafer probe or the like
US4109846A · kind A · utility
11Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 17, 1977 |
| Grant date | Aug 29, 1978 |
| Priority date | — |
| Expiry date | May 17, 1997 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67138
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A height sensor is disclosed which permits a tool to sense the height of a semiconductor die, or the like, above a work surface such as a bonding table. A tool arm moves transverse to the work surface and is interconnected to a cam by a second arm. The second arm is disengageable from the first arm and disengages the first arm when the tool contacts the semiconductor die. Sensing means are provided to detect the separation of the two arms.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.