Method of making fluid system circuit board
US4110140A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 1976 |
| Grant date | Aug 29, 1978 |
| Priority date | — |
| Expiry date | Dec 15, 1996 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/2224
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A fluid pneumatic circuit board includes a base plate and a flat cover plate molded of a suitable plastic such as polysulfone. The plates are chemically bonded with a thermal adhesive such as a refrigerated solid sheet of epoxy. The base plate has a planar surface within which the fluid circuit passageways, as well as structural board and component supports are integrally molded. The cover plate has individual sealing ribs formed to encircle each of the passageways. The epoxy sheet is shaped to cover the passageways, and with openings aligned with the exhaust openings in the cover plate. The plates, with the adhesive sheet therebetween, is clamped together and heated in an oven to soften the adhesive. The sealing rib has inclined sidewalls and an outer flat sealing wall, with an included angle of 60.degree. and a tip width equal to the sheet thickness and a height equal 21/2 times the sheet thickness. Moisture and/or gas in the softened plastic escape from under the tip and prevent formation of bubbles. Relatively small, reliable components can be internally mounted and bonded in place.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.