Metallized plastic molding
US4112190A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 16, 1977 |
| Grant date | Sep 5, 1978 |
| Priority date | — |
| Expiry date | Jun 16, 1997 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A metallized plastic molding comprises a plastic substrate, a primer layer having a gel percentage of at least 80% and a swelling degree of 20% or less deposited on said substrate and a metallic film deposited on the primer layer. The metallized plastic molding is prepared by coating a plastic substrate with a primer forming material containing at least one compound having a molecular weight of 150 - 2000 and containing at least two polymerizable unsaturated groups in one molecule, curing the primer forming material so that it has a gel percentage of at least 80% and a swelling degree of 20% or less to form a primer layer and then depositing a metallic film layer by a dry type method on the primer layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.