Soldering apparatus
US4113165A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 20, 1977 |
| Grant date | Sep 12, 1978 |
| Priority date | — |
| Expiry date | Sep 20, 1997 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K3/0669
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The disclosure embraces a soldering apparatus which includes a vessel having an open top for containing a molten soldering material such as tin, a ladle having a scoop portion and a tank which is connected to the scoop by a pipe; the ladle is movable into and out of the vessel whereby the tank and scoop will become filled with the soldering material upon submergence of the ladle in the vessel; the tank has a selected dimension and lower height relative to the scoop so that the soldering material will form a meniscus bubble over its surface which will be free of slag or oxidation material to thereby present a clean soldering bath to the elements to be soldered when the tank is raised out of the soldering bath of the vessel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.