Method of manufacturing insulating board
US4113554A · kind A · utility
3Cited by
9References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 1, 1977 |
| Grant date | Sep 12, 1978 |
| Priority date | — |
| Expiry date | Nov 1, 1997 |
Classification
- Technology area (CPC D)Textiles; Paper
- CPC primaryD21J1/04
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A high density insulating board is produced by a process which includes forming a wet multi-ply board of fibrous material, substantially free of resin, on the roll of a wet cylinder machine, drying the board, placing the dry board in a press, and then hot pressing the board at a differential temperature of about 15.degree. to about 40.degree. F across the board for at least 30 seconds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.