Flexible circuit reflow soldering process and machine
US4115601A · kind A · utility
18Cited by
7References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 1977 |
| Grant date | Sep 19, 1978 |
| Priority date | — |
| Expiry date | Jul 1, 1997 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process and machine are disclosed for reflowing solder plated continuous flexible circuit webs. During reflow in a vapor environment, the flexible web is maintained in a planar orientation to produce a relatively uniform distribution of solder. Virtually all of the heat transfer fluid used in producing the vapor is recovered and retained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.