Storable, rapidly hardening epoxy resin adhesive
US4117038A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 27, 1977 |
| Grant date | Sep 26, 1978 |
| Priority date | — |
| Expiry date | Dec 27, 1997 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A storable, rapidly hardening epoxy resin adhesive consisting essentially of PA1 A. a polyglycidyl compound having a softening temperature between 40.degree. and 90.degree. C, PA1 b. a salt of 1 mole of ethylenediamine, 1 mole of bisphenol A and 2 g of N,N-dimethyl-1,3-diaminopropane, PA1 C. an ABS graft polymer and PA1 D. a copolymer of ethylene, acrylic acid and acrylate having a melting range from 70.degree. to 110.degree. C, said adhesive comprises, per 1 equivalent of glycidyl groups, 0.5 to 1.5 equivalents of hydrogen atoms bonded to nitrogen of ethylenediamine and of N,N-dimethyl-1,3-diaminopropane, and per 100 parts of the polyglycidyl compound contains 3 to 30 parts by weight of the ABS graft polymer and 3 to 20 parts by weight of the copolymer of ethylene, acrylic acid and acrylate, and said adhesive is in the form of a fine heterogeneous powder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.