Strippable solder mask material comprising polysulfone, silicon dioxide filler, and solvent
US4120843A · kind A · utility
12Cited by
19References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 10, 1978 |
| Grant date | Oct 17, 1978 |
| Priority date | — |
| Expiry date | Apr 10, 1998 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0769
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A polysulfone base stop resist material to protect gold thermocompression bonding sites on a circuit module during a solder dipping operation. Along with the thermoplastic, thermostable strippable base of polysulfone, the resist includes a solvent for the polysulfone and a filler which holds the melted polysulfone in place during the solder dipping operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.