Printed circuit board made by dispersion imaging
US4121007A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 10, 1976 |
| Grant date | Oct 17, 1978 |
| Priority date | — |
| Expiry date | Aug 10, 1996 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24975
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A novel printed circuit board with a circuit of high precision having a polymer coat layer between a base and a dispersion imaging material layer and a pattern circuit on undispersed portions of the dispersion imaging material layer. Such a printed circuit board is prepared by a simplified process which comprises essentially two steps, namely, exposure of the dispersion imaging material through a circuit pattern mask to obtain a pattern circuit of the unexposed portions and conductive metal plating wherein said unexposed portions are selectively deposited with the conductive metal due to the specific effect of provision of the polymer coat layer directly under the dispersion imaging material layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.