Patent · US Expired

Storable rapidly hardening epoxy resin adhesive

US4122128A · kind A · utility

15Cited by

4References

6Claims

0Family size

Assignee

Ciba-Geigy · US

Inventors

Hans D. Lehmann · Leutershausen, DE
Helmut Zondler · Bottmingen, CH

Key dates

Filing date	Dec 27, 1977
Grant date	Oct 24, 1978
Priority date	—
Expiry date	Dec 27, 1997

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L2666/04
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

A storable, rapidly hardening epoxy resin adhesive consisting of PA1 A. a polyglycidyl compound having a softening temperature between 40.degree. and 90.degree. C, PA1 b. a 2,5-di-(.omega.-aminoalkyl-1')-pyrazine of the formula ##STR1## wherein n is an integer from 3 to 6, and C. A COPOLYMER OF ETHYLENE, ACRYLIC ACID AND ACRYLATE HAVING A MELTING RANGE FROM 70.degree. TO 110.degree. C, said epoxy resin adhesive contains, per 1 equivalent of glycidyl groups, 0.5 to 1.5 equivalents of hydrogen atoms bonded to nitrogen of the 2,5-di(.omega.-aminoalkyl-1')-pyrazine and, per 100 parts by weight of the polyglycidyl compound, contains 3 to 20 parts by weight of the copolymer of ethylene, acrylic acid and acrylate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.