Patent · US Expired

Thermoplastic reinforcing adhesives and substrates coated therewith

US4122229A · kind A · utility

9Cited by
7References
4Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 6, 1977
Grant dateOct 24, 1978
Priority date
Expiry dateJun 6, 1997

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T442/2361
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

Copolyamides derived from mixed acids (a polymeric fatty acid and short-chain dibasic acid) and mixed amines (a polyoxyalkylene diamine and a short-chain diamine) are provided. These thermoplastic resin compositions are excellent reinforcing adhesives for flexible substrates and are particularly useful as box-toe construction resins.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.