Modular printed circuit board assembly having cooling means incorporated therein
US4122508A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 6, 1977 |
| Grant date | Oct 24, 1978 |
| Priority date | — |
| Expiry date | Sep 6, 1997 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20563
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A modular printed circuit board assembly has a plurality of printed circuit boards each of which is integrated with a separate heat sink to form a modular unit. Each such modular unit is removably supported in a housing on a separate pair of support tracks in the base and top cover of the housing, bottom edges of the printed circuit board and a runner formed on the edge of the heat sink riding in these tracks. Each of the heat sinks has a flange portion to which the associated printed circuit board is attached and on which elements such as power transistors which generate a substantial amount of heat are directly mounted. The main body portion of each heat sink has a plurality of fins in the form of longitudinal strips with longitudinal slots being formed between the fins. The printed circuit boards and their associated heat sinks joined together to form integral units are installed on the chassis in side-by-side relationship with the fins and slots in alignment with each other such that the slots of adjacent heat sinks form longitudinal channels. Continuous air circulation is provided through the channels thus formed by means of a blower which communicates with the ambient air and…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.