Process for chemically bonding a poly-p-xylylene to a thermosetting resin and article produced thereby
US4123308A · kind A · utility
46Cited by
10References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 19, 1977 |
| Grant date | Oct 31, 1978 |
| Priority date | — |
| Expiry date | Oct 19, 1997 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2465/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Poly-p-xylylene is chemically bonded to a thermoset resin via a reaction between oxygen-containing groups at the surface of the poly-p-xylylene and a reactant component of the thermosetting resin. A low temperature plasma is employed to chemically modify the surface of the poly-p-xylylene to incorporate the oxygen atoms into the backbone of the polymer at its surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.