Method for mounting chip type circuit elements on a printed circuit board and apparatus for performing the same
US4127432A · kind A · utility
45Cited by
6References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 12, 1977 |
| Grant date | Nov 28, 1978 |
| Priority date | — |
| Expiry date | Apr 12, 1997 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1759
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Chip type circuit elements are mounted on adhesive layers provided on predetermined positions of a printed circuit board by pushing up each circuit element stack inserted in a magazine which is vertically held just below the corresponding adhesive layer and which is inserted through a corresponding through-hole defined by a lattice-shaped and horizontally placed magazine guide. This method and apparatus can quickly mount chip type circuit elements on the printed circuit board, and make possible an easy change of the circuit element pattern, without necessitating the use of an NC machine.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.