Baking finishes of low solvent content
US4128521A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 1, 1977 |
| Grant date | Dec 5, 1978 |
| Priority date | — |
| Expiry date | Aug 1, 1997 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L63/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention relates to baking finishes of low solvent content, consisting essentially of an acrylate resin, an epoxy resin and a mixture of organic solvents, with or without pigment, catalyst and other conventional auxiliaries, in which the acrylate resin is a copolymer which contains from 10 to 35% by weight of .alpha.,.beta.-olefinically unsaturated carboxylic acids as copolymerized units, has a very low K value and has an acid number of from 70 to 250 mg of KOH/g, the epoxy resin contains at least 2 oxirane groups per molecule and the mixture of organic solvents is a mixture of from 20 to 80% by weight of a solvent having a boiling point of from 100.degree. to 280.degree. C and a dielectric constant of from 2 to 4.99, and from 80 to 20% by weight of a solvent having a boiling point of from 80.degree. to 200.degree. C and a dielectric constant of from 5 to 27. The weight ratio of acrylate resin to epoxy resin is from 9:1 to 6:4. These baking finishes of low solvent content may be used, e.g., as finished for domestic equipment and as automotive primers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.