Thermoplastic adhesives
US4128525A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 20, 1976 |
| Grant date | Dec 5, 1978 |
| Priority date | — |
| Expiry date | Feb 20, 1996 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31725
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Novel thermoplastic adhesive components, prepared from inexpensive and readily available synthetic materials, having melting points between about 20.degree. C. to about 180.degree. C. and broad ranges of hardness, flexibility and compatibility are disclosed. The novel thermoplastic compounds useful in adhesive formulations are comprised of a resinous polyamide reaction product of a polyoxypropylene polyamine having an average molecular weight of from about 190 to about 3,000 and being selected from diamines, triamines, or mixtures thereof, piperazine and an aliphatic or aromatic dicarboxylic acid, ester or anhydride having from about 4 to about 20 carbon atoms per molecule. The resinous polyamide reaction product is prepared by mixing and reacting the polyoxypropylene polyamine, piperazine, and dicarboxylic acid materials in a total amine:acid molar ratio within the range of from about 0.25:1.0 to about 4.0:1.0 at a temperature of from about 175.degree. C. to about 270.degree. C. The inventive thermoplastic polyamides can be formulated with compatible plasticizing agents to prepare a useful adhesive to which can also be added other components, such as a minor amount of a polyepoxid…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.