Semiconductor transducer packaged assembly
US4129042A · kind A · utility
59Cited by
2References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 18, 1977 |
| Grant date | Dec 12, 1978 |
| Priority date | — |
| Expiry date | Nov 18, 1997 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48465
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor transducer chip is flip-chip bonded to a semiconductor interface chip, which is mounted on the ceramic package. Thermal coupling between the package and the transducer chip is minimized by the small contact area between the transducer chip and interface chip. Micron size spacing between the spring membrane in the transducer chip and the interface chip produces squeeze film damping of the spring membrane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.