Solder connection between copper and aluminum conductors
US4129744A · kind A · utility
11Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 2, 1976 |
| Grant date | Dec 12, 1978 |
| Priority date | — |
| Expiry date | Aug 2, 1996 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49202
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A solder connection between an aluminum and copper conductor includes cladding a strand of aluminum wire with a copper coating, severing the cladded aluminum wire to a suitable length and soldering the severed end to the strand of copper wire with a lead-tin solder forming a hermetical seal about the soldered joint including any portion of the aluminum exposed to the ambient at the joint prior to soldering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.