Patent · US Expired

Production of an improved polyoxymethylene molding composition which forms reduced mold deposits upon molding

US4130604A · kind A · utility

4Cited by
5References
25Claims
0Family size

Assignee

Inventor

Key dates

Filing dateOct 28, 1977
Grant dateDec 19, 1978
Priority date
Expiry dateOct 28, 1997

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L69/00
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

The mold deposit problem commonly associated with polyoxymethylene molding compositions which creates a non-uniform surface on a molded article effectively is minimized. The polyoxymethylene polymer initially is heated (as described) while in admixture with about 1 to about 4 percent by weight based upon the weight of the oxymethylene polymer of an aromatic polycarbonate (as defined). In a preferred embodiment a minor quantity of malonamide also is admixed with polyoxymethylene polymer and the aromatic polycarbonate during heating.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.