Apparatus for cutting and removing dry film photoresist from printed wire boards
US4131042A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 27, 1977 |
| Grant date | Dec 26, 1978 |
| Priority date | — |
| Expiry date | Dec 27, 1997 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/8748
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Apparatus for cutting and removing layers of photoresist overlaying tooling holes in a printed wire board blank. A lower cutter is mounted on a base so that its cutting edge projects above the upper surface of the base a distance substantially equal to the thickness of a layer of photoresist. A cutter head is mounted on the base for movement parallel to the upper surface of the base. An upper cutter is mounted on the cutter head for movement by a cutter actuator to cause the upper and lower cutters to sever segments of layers of photoresist overlaying a tooling hole of a PWB blank positioned between them. Each cutter is provided with a plunger movable within their respective cutters. The upper surface of the lower plunger, when the lower plunger is retracted, projects above the lower cutting edge of the lower cutter; and the upper plunger is biased downwardly so that its bottom surface projects below the cutting edges of the upper cutter. As a result the plungers stress the photoresist layers overlaying a tooling hole prior to the upper and lower cutters engaging them. A plunger actuator then moves the lower plunger toward the upper plunger pressing the severed segments together an…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.