Method of making metal filled via holes in ceramic circuit boards
US4131516A · kind A · utility
55Cited by
3References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 1977 |
| Grant date | Dec 26, 1978 |
| Priority date | — |
| Expiry date | Jul 21, 1997 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A ceramic substrate is provided with via holes and these holes are primed by first depositing a palladium coating to the inside surface of the holes and then depositing an iron film onto the palladium. The primed holes are then completely filled with copper to provide conductive connections between opposite surfaces of the substrate. On one side of the substrate, input/output connector pins are brazed to the copper fillings. On the other side, printed circuitry is applied to produce a circuit module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.