Surface treating process for copper foil for use in printed circuit
US4131517A · kind A · utility
34Cited by
3References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 3, 1977 |
| Grant date | Dec 26, 1978 |
| Priority date | — |
| Expiry date | Jun 3, 1997 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S428/901
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A surface treating process for a copper foil for use in a printed circuit, in which the surface of a copper foil is subjected to a cathodic treatment in an electrolytic bath of an aqueous solution of sulfuric acid, containing nickel and copper ions, with the copper foil being used as a cathode. The copper foil thus subjected to cathodic treatment is brought into contact with an aqueous solution containing one of sodium hexametaphosphate .alpha.-nitroso R salt, 2-mercaptobenzothiazole, rubeanic acid, anthranilic acid, benzenesulfonamide, phthalic acid, potassium dichromate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.